The USDA Forest Service Forest Products Laboratory (FPL) and the Forest Products Society (FPS) and the International Union of Forestry Research Organizations (IUFRO) are proud to announce the 20th International Nondestructive Testing and Evaluation of Wood Symposium, to be held in Madison, Wisconsin, from Sept. 12-15. The conference will be held at the Forest Products Laboratory, located on the campus of the University of Wisconsin-Madison.

The Symposium will include oral and poster presentations from scientists and engineers, and exhibits from equipment development and manufacturing firms. The Symposium organizing committee invites papers, posters and equipment demonstrations (exhibits) from interested individuals and organizations.

Subject areas include:

• Nondestructive characterization of wood and wood-based materials
• Evaluation of forest materials for optimal utilization
• Advanced grading technologies for solid wood and engineered wood products
• Condition assessment, evaluation, and repair of existing wood structures
• Condition assessment of historic wood artifacts and structures
• Evaluation and assessment of urban trees
• Industrial application of emerging nondestructive testing technologies
• Other nondestructive evaluation related research and development activities

The deadline to submit abstracts is Wednesday, Feb. 1.

Details: http://forestprod.org/symposium/